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IC Die-Level Monitoring Solutions

Ridgetop’s Independent Die-Level Fab Process Monitoring Tools

Ridgetop provides in-situ measurement solutions for IC, board, and modules used in critical systems. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

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Instacell

Analog-to-Digital Converters

Ridgetop’s ADC architecture is optimized for high performance. Applications include industrial control, automotive and consumer electronics.

Analog-to-Digital layout

Digital-to-Analog Converters

Ridgetop’s DAC architecture is proven in silicon for rigorous applications.

Digital-to-Analog layout

nanoDFM

Ridgetop’s nanoDFM™ technologies apply advanced and patented in-situ test structures and iterative improvements. By providing performance metrics and electrical testing, useful lifetime is increased and yields improved. To do this, the most sensitive circuits must be identified as well as the mechanisms likely to have negative effects.

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nanoDFM Design Flow Using DLPM