Analog-to-Digital

ADC 10-Bit, 4 MSps, TSMC 0.25 μ IP Core

Features and Benefits

  • 10 bits of resolution
  • 4 MSps sampling rate
  • TSMC 0.25 μm mixed-signal process (retargetable)
  • 3.0-3.6 V analog supply voltage
  • 2.25-2.75 V digital supply voltage
  • Pin provided for enable mode
  • External (or internal) reference voltage
  • Up to 10 analog inputs
  • MIM capacitors
  • Pipeline architecture

Download a datasheet. [PDF]

ADC/VGA 14-Bit, 40 MSps, TSMC 180 nm IP Core

Features and Benefits

  • 14 bits of resolution
  • 40 MSPS sampling rate
  • TSMC 180 nm mixed mode process
  • 3.3 V analog supply voltage
  • 3.3 V digital I/O supply voltage
  • Differential input
  • Pipeline architecture
  • 4-bit variable gain

Download a datasheet. [PDF]

ADC 14-Bit, 40 MSps, TSMC 180 nm IP Core

Features and Benefits

  • 14 bits of resolution
  • 40 MSPS sampling rate
  • TSMC 180 nm mixed mode process
  • 3.3 V analog supply voltage
  • 3.3 V digital I/O supply voltage
  • Differential input
  • Pipeline architecture
  • 4-bit variable gain

Download a datasheet. [PDF]

14-bit, 40 MSPS, 130 nm IP Core

Features and Benefits

  • 14 bits of resolution (12-bit) accuracy
  • 40 MSPS sampling rate
  • IBM 130 nm BiCMOS 8 HP process node
  • 3.3 V analog supply voltage
  • 2.5 V digital I/O supply voltage
  • Signal-to-noise ratio: 75 dB
  • Signal-to-noise plus distortion ratio: 72 dB
  • Customized configurations available

Download a datasheet. [PDF]

Changing Technology

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC applications. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

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