Analog-to-Digital

ADC 10-Bit, 4 MSps, TSMC 0.25 μ IP Core

Features and Benefits

  • 10 bits of resolution
  • 4 MSps sampling rate
  • TSMC 0.25 μm mixed-signal process (retargetable)
  • 3.0-3.6 V analog supply voltage
  • 2.25-2.75 V digital supply voltage
  • Pin provided for enable mode
  • External (or internal) reference voltage
  • Up to 10 analog inputs
  • MIM capacitors
  • Pipeline architecture

Download a datasheet. [PDF]

ADC/VGA 14-Bit, 40 MSps, TSMC 180 nm IP Core

Features and Benefits

  • 14 bits of resolution
  • 40 MSPS sampling rate
  • TSMC 180 nm mixed mode process
  • 3.3 V analog supply voltage
  • 3.3 V digital I/O supply voltage
  • Differential input
  • Pipeline architecture
  • 4-bit variable gain

Download a datasheet. [PDF]

ADC 14-Bit, 40 MSps, TSMC 180 nm IP Core

Features and Benefits

  • 14 bits of resolution
  • 40 MSPS sampling rate
  • TSMC 180 nm mixed mode process
  • 3.3 V analog supply voltage
  • 3.3 V digital I/O supply voltage
  • Differential input
  • Pipeline architecture
  • 4-bit variable gain

Download a datasheet. [PDF]

14-bit, 40 MSPS, 130 nm IP Core

Features and Benefits

  • 14 bits of resolution (12-bit) accuracy
  • 40 MSPS sampling rate
  • IBM 130 nm BiCMOS 8 HP process node
  • 3.3 V analog supply voltage
  • 2.5 V digital I/O supply voltage
  • Signal-to-noise ratio: 75 dB
  • Signal-to-noise plus distortion ratio: 72 dB
  • Customized configurations available

Download a datasheet. [PDF]

Changing Technology

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC, board, and modules used in critical systems. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

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