InstaCell™ IP Core Library

The cores provided by Ridgetop are "Silicon Proven" and have documented reports available. Ridgetop has designed cores for use in the IBM, TSMC, and AMI processes.

  • Analog-to-Digital Converter (ADC) Cores
  • Digital-to-Analog Converter (DAC) Cores
  • Band Gap Reference (BGR) Core
  • Op Amp Core

Analog-to-Digital Converters

Ridgetop’s ADC architecture is optimized for high performance. Applications include industrial control, automotive, and consumer electronics.

Features and Benefits

  • Mismatch measurement of threshold voltage (VT)
  • Nano-level (sub-90 nm) measurement of feature size transistors
  • Mismatch measurement of resistance and capacitance
  • Die-to-die variation analysis
  • Long-term reliability and variation analysis
  • Extensibility
  • Digital output (option)

Digital-to-Analog Converters

Ridgetop’s DAC architecture is proven in silicon for rigorous applications.

Features and Benefits

  • Mismatch measurement of threshold voltage (VT)
  • Nano-level (sub-90 nm) measurement of feature size transistors
  • Mismatch measurement of resistance and capacitance
  • Die-to-die variation analysis
  • Long-term reliability and variation analysis
  • Extensibility
  • Digital output (option)

Changing Technology

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC, board, and modules used in critical systems. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

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