InstaCell™ IP Core Library

The cores provided by Ridgetop are "Silicon Proven" and have documented reports available. Ridgetop has designed cores for use in the IBM, TSMC, and AMI processes.

  • Analog-to-Digital Converter (ADC) Cores
  • Digital-to-Analog Converter (DAC) Cores
  • Band Gap Reference (BGR) Core
  • Op Amp Core

Analog-to-Digital Converters

Ridgetop’s ADC architecture is optimized for high performance. Applications include industrial control, automotive, and consumer electronics.

Features and Benefits

  • Mismatch measurement of threshold voltage (VT)
  • Nano-level (sub-90 nm) measurement of feature size transistors
  • Mismatch measurement of resistance and capacitance
  • Die-to-die variation analysis
  • Long-term reliability and variation analysis
  • Extensibility
  • Digital output (option)

Digital-to-Analog Converters

Ridgetop’s DAC architecture is proven in silicon for rigorous applications.

Features and Benefits

  • Mismatch measurement of threshold voltage (VT)
  • Nano-level (sub-90 nm) measurement of feature size transistors
  • Mismatch measurement of resistance and capacitance
  • Die-to-die variation analysis
  • Long-term reliability and variation analysis
  • Extensibility
  • Digital output (option)

Changing Technology

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC applications. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

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