Resource Library

White Papers

• An Innovative Approach to Electromechanical Actuator Emulation and Damage Propagation Analysis
  
  This paper details Ridgetop’s innovative approach to emulating avionic electromechanical actuator operation for NASA’s Integrated Vehicle Health Management (IVHM) program.
• Real-Time BIST Detector for BGA Faults in Field Programmable Gate Arrays (FPGAs)
  
  Introduces a solder-joint built-in-self-test (SJ BIST) for detecting high-resistance and intermittent faults in operational, fully programmed field programmable gate arrays (FPGAs).
• Return-On-Investment(ROI) for Electronic Prognostics in High Reliability Telecom Applications
  
  Presented at the 2006 INTELEC Conference in Rhode Island, defines the approach and methodology for deployment of prognostics in Telecom power supplies.
• Return-On-Investment(ROI) for Electronic Prognostics in Mil/Aero Systems
  
  Presented at the Autotestcon Conference, describes a methodology for quantifying ROI for the adoption of electronic prognostics in Mil/Aero systems.
• Practical Application of PHM/Prognostics to COTS Power Converters
  
  Presented at the IEEE Aerospace Conference and describes a methodology for implementing electronic prognostics on a DC to DC forward converter.
• In-situ Sensors for Product Reliability Monitoring
  
  Co-written with CALCE (University of Maryland)  describes an in-situ sensor (prognostic monitor) approach, which can be used to estimate the accumulated damage and the remaining life of semiconductor devices.
• Prognostic Techniques for Semiconductor Failure Modes
  
  Surveys problems and presents a methodology for the inclusion of pre-calibrated prognostic cells that can be co-located with a host circuit to provide an early-warning of a system failure, so that appropriate corrective action can be taken.
• RINCON - A Rigorous Tool for Accurate RF/Microwave Modeling and Simulation.
  
  A key benefit of creating a new analysis tool is the ability to incorporate recent advances in modeling technology to provide the RF/Microwave Designer with enhanced capabilities. Using VHDL-AMS as a base, the authors have developed a powerful modeling/simulation tool with unparalleled modeling capabilities for rigorous and accurate modeling of complex devices.
• Statistical Pattern Recognition and Built-in Reliability Test
  
  Development of a new solder-interconnect built-in reliability test, FFT-based statistical pattern recognition, and time-frequency moments-based statistical pattern recognition.
• Real-Time Detector for Faults in Solder Joint Networks
  
  Initial test results of an innovative, in-situ solder-joint built-in self-test (SJ BISTâ„¢) to detect high-resistance damage to solder-joint networks of fully operational Field Programmable Gate Arrays (FPGAs) in ball-grid array (BGA) packages.
• Real-Time Detection of Solder-Joint Faults
  
  Two sensors for real-time detection of solder-joint faults in programmed, operational Field Programmable Gate Arrays (FPGAs), especially those FPGAs in Ball Grid Array (BGA) packages. The first sensor uses a method in-situ within the FPGA and the second sensor uses a method external to the FPGA.
• Ball Grid Array (BGA) Solder Joint Intermittency Detection
  
  Test results and specifications for SJ BISTâ„¢, an innovative sensing method for detecting faults in solder-joint networks that belong to the I/O ports of Field Programmable Gate Arrays (FPGAs), especially in Ball Grid Array packages.
• A Low-Power Sensor Design
  
  Introduce SJ Monitorâ„¢, a lower-power design (less than 5.0 mW) to provide 24x7 health monitoring of selected I/O pins.
• Real-Time Detector For Faults in Solder Joint Networks Belonging to FPGA
  
  Introduces an in-situ, solder-joint built-in self-test (SJ BIST) for detecting high-resistance faults in operational, fully-programmed Field Programmable Gate Arrays(FPGAs).
• Intermittency Detection and Mitigation in Ball Grid Array (BGA) Packages
  
  An update on a firmware method (SJ BISTâ„¢) to detect intermittencies in Ball Grid Array (BGA) packages and introduces a method that uses hardware on a chip (SJ Monitorâ„¢) that also detects the same types of intermittencies.
• A Sensor for Real-Time Detection of Solder-Joint Faults
  
  Presents a sensor for real-time detection of solder-joint faults in programmed, operational Field Programmable Gate Arrays (FPGAs), especially those FPGAs in Ball Grid Array (BGA) packages.
• High Density FPGA Package BIST Technique
  
  Describes the work that the Ridgetop Group Inc., did to provide a self-contained built-in self-test (BIST) solution that effectively detects the degradation and eventual failure of the Field Programmable Gate Array (FPGA).
• VHDL Approach Improves Nonlinear Simulation
  
  A new approach to harmonic-balance simulation uses a frequency-domain-extended standardized modeling language to support the use of black boxes in simulations.