Ridgetop’s Semiconductor and IC divisions
provide advanced,
in-situ test structures that support design-for-manufacturing
(DFM) applications.
With shrinking semiconductor process geometries of 65 nm or
less, it is not possible to directly probe the devices to determine
their variations from nominal. Ridgetop pioneered the development
of precision die-level test structures that address variations in
threshold voltage, current, resistance and capacitance.
In addition, Ridgetop offers proven capabilities for measurement
of Time Dependent Dielectric Breakdown (TDDB), Hot Carrier
Injection (HCI), and Negative Bias Temperature Instability
(NBTI).
Ridgetop has supplied the analog/mixed signal requirements of
commercial customers for many years. In addition, for our
military/aerospace customers, Ridgetop provides fault-tolerant ICs.
These include radiation-hardened components for operation in space
or near particle accelerators.
Call us to set up an appointment while at SEMICON West . . . you
will be glad that you did! |
Ridgetop's Preferred Partner Program [PDF
239KB] »