Analog-to-Digital

ADC 10-Bit, 4 MSps, TSMC 0.25 μ IP Core

Features and Benefits

  • 10 bits of resolution
  • 4 MSps sampling rate
  • TSMC 0.25 μm mixed-signal process (retargetable)
  • 3.0-3.6 V analog supply voltage
  • 2.25-2.75 V digital supply voltage
  • Pin provided for enable mode
  • External (or internal) reference voltage
  • Up to 10 analog inputs
  • MIM capacitors
  • Pipeline architecture

Download ADC 1004 Datasheet

ADC/VGA 14-Bit, 40 MSps, TSMC 180 nm IP Core

Features and Benefits

  • 14 bits of resolution
  • 40 MSPS sampling rate
  • TSMC 180 nm mixed mode process
  • 3.3 V analog supply voltage
  • 3.3 V digital I/O supply voltage
  • Differential input
  • Pipeline architecture
  • 4-bit variable gain

Download ADC 1440A Datasheet

ADC 14-Bit, 40 MSps, TSMC 180 nm IP Core

Features and Benefits

  • 14 bits of resolution
  • 40 MSPS sampling rate
  • TSMC 180 nm mixed mode process
  • 3.3 V analog supply voltage
  • 3.3 V digital I/O supply voltage
  • Differential input
  • Pipeline architecture
  • 4-bit variable gain

Download 1440 Datasheet

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC applications. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

Fabless Semiconductor
Design House

Was it a design problem or a process/foundry problem?

Ridgetop’s PDKChek® die-level test structure provides independent verification of foundry-supplied parameters.

Process-aware designs

Ridgetop’s PDKChek provides in-situ measurements to correct for parametric variations in the die, improving production yields and major savings!

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