Ridgetop Design Services

Ridgetop Group’s engineers have extensive experience designing custom, high-performance solutions to customer requirements. Our design services include:

  • Analog/mixed-signal and gate array integrated circuits with varying process nodes of 0.5 μm down to 90 nm
  • High-speed ADC and DAC design
  • FPGA-based designs, from basic specification to gate level, with timing analysis and programming
  • IP blocks of specialized functionality
  • Modeling and simulation
  • Completion of back-end design from existing EDIF/SPICE to GDSII
  • Rescaling “legacy” designs to smaller process geometries
  • Radiation-hardened/foundry-specific designs

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC applications. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

Fabless Semiconductor
Design House?

Was it a design problem or a process/foundry problem?

Ridgetop’s PDKChek® die-level test structure provides independent verification of foundry-supplied parameters.

Process-aware designs?

Ridgetop’s PDKChek provides in-situ measurements to correct for parametric variations in the die, improving production yields and major savings!

Customer Service

Reach our staff from 8:00AM to 5:00PM (MST).

520-742-3300 (p)
520-544-3180 (f)




Video

Watch our company intro

Video

Watch a demonstration of RingDown technology