Download MEMS Accelerometer Technology Brief
Ridgetop Group has leveraged its work on several related DOD and NASA contract awards to develop a first silicon prototype of an integrated MEMS capacitive accelerometer on a CMOS die. The innovative low temperature MEMS deposition post-processing step lowers the cost of development as no changes to the CMOS process flow are required.
The sensor is part of the broader development plan for a generic sensor interface chip (GSIC) architecture that is able to accept input from a variety of transducers. The chip comprises a smart sensor interface with on-chip signal conditioning, analog-to-digital conversion, data reduction and DSP, and wireless connectivity. The image below shows a system-level representation of the Ridgetop MEMS Sensor.
