Download nanoDFM overview
The success of nano-level integrated circuits depends on the integration of advanced methodologies throughout the entire semiconductor process development cycle. Ridgetop Group’s nanoDFM product suite provides that level of integration, to combat yield losses stemming from process-related and design-related problems. nanoDFM improves the reliability of emerging nanolevel processes for fabless and fab manufacturers.
The interaction between design and manufacturing, particularly as it
relates to yield and reliability, extends beyond on-site measurements
and design simulations alone. Ridgetop’s nanoDFM technologies apply
advanced and patented in-situ test structures and iterative
improvements. By providing performance metrics and electrical testing,
useful lifetime is increased and yields improved. To do this, the most
sensitive circuits must be identified as well as the mechanisms likely
to have negative effects.
nanoDFM Design Flow Using DLPM
Features and Benefits
- Mismatch measurement of threshold voltage (VT)
- Nano-level (sub-90 nm) measurement of feature size transistors
- Mismatch measurement of resistance and capacitance
- Die-to-die variation analysis
- Long-term reliability and variation analysis
- Extensibility
- Digital output (option)
