Ridgetop TDDB EPU

Time-Dependent Dielectric Breakdown Electronic Prognostics Unit

Download a TDDB overview

The Ridgetop TDDB EPU is a pad-limited CMOS leakage detection cell.

Its unique and proprietary architecture behaves as an early-warning “sentinel” of upcoming gate oxide failure. The amount of pre-warning is dependent on the prognostic distance, which depends on the area and the stress voltage.

The Ridgetop TDDB EPU is designed to be co-located with the host circuit and subjected to the same environmental stresses. These environmental stresses contribute to aging of the circuit and can include over- and under-voltage conditions, transient spikes, radiation exposure, humidity, and excessive temperature conditions.

Features and Benefits

  • Alerts upcoming gate oxide failure condition due to TDDB
  • Consumes approximately 600 microwatts of power
  • Efficient size at 500 μm2 at the 0.13 micron process size
  • Scalable using design equation
  • Detects both hard and soft breakdowns
TDDB Layout

Why do you need Ridgetop die-level test structures?

We provide in-situ measurement solutions for IC applications. When you can monitor key parameter variation and performance degradation, you can take corrective or preventive action much faster and more easily.

Fabless Semiconductor
Design House?

Was it a design problem or a process/foundry problem?

Ridgetop’s PDKChek® die-level test structure provides independent verification of foundry-supplied parameters.

Process-aware designs?

Ridgetop’s PDKChek provides in-situ measurements to correct for parametric variations in the die, improving production yields and major savings!

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520-742-3300 (p)
520-544-3180 (f)




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