SJ BIST™ Intermittency Detection

Cracked Solder Ball

Cracked Solder Ball

Intermittent and catastrophic faults in electronic control systems can now be avoided with Ridgetop Group's SJ BIST™. The SJ BIST (Solder Joint Built-In Self-Test) technology accurately detects and reports instances of high resistance, including intermittent opens, in field programmable gate arrays (FPGAs)-to-board interfaces. connectors and cables, and other high density electrical interconnection systems. In addition, SJ BIST is used for detecting cracks in IC substrates and IC package qualification. SJ BIST is part of the Sentinel Interconnect™ family of products.

Solder joints and other physical connections are subject to mechanical failure; they inevitably suffer damage from thermal and vibration stresses, causing troublesome intermittent connections between components on the boards. The ability to measure, detect, and predict solder aging and the resultant failure of electronic modules is a true advancement in electronics reliability.

SJ BIST Features

  • Detects damage prior to catastrophic failure of FPGA-to-board interface
  • Independently tested and verified
  • Works with new processes and equipment
  • Endorsed by leading automotive and aerospace customers
SJ BIST two port test

SJ BIST two-port test, 1 MHz clock – click to enlarge

For more information, contact us directly, or follow the links below.


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Related Products


  • Interconnect Intermittency Detection with SJ BIST™ – Broadcast by Microsemi

Click here to download the webinar presentation (PPTX)
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