Cracked Solder Ball
Intermittent and catastrophic faults in electronic control systems can now be avoided with Ridgetop Group’s SJ BIST™. The SJ BIST (Solder Joint Built-In Self-Test) technology accurately detects and reports instances of high resistance, including intermittent opens, in field programmable gate arrays (FPGAs)-to-board interfaces. connectors and cables, and other high density electrical interconnection systems. In addition, SJ BIST is used for detecting cracks in IC substrates and IC package qualification. SJ BIST is part of the Sentinel Interconnect™ family of products.
Solder joints and other physical connections are subject to mechanical failure; they inevitably suffer damage from thermal and vibration stresses, causing troublesome intermittent connections between components on the boards. The ability to measure, detect, and predict solder aging and the resultant failure of electronic modules is a true advancement in electronics reliability.
SJ BIST Features
- Detects damage prior to catastrophic failure of FPGA-to-board interface
- Independently tested and verified
- Works with new processes and equipment
- Endorsed by leading automotive and aerospace customers
SJ BIST two-port test, 1 MHz clock – click to enlarge
For more information, contact us directly, or follow the links below.
Overviews
Product Brief
Selected White Papers
- A Sensor for Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays
- Solve Interconnect Reliability Issues Using Flip-Chip Testing with SJ BIST™
- Ball Grid Array (BGA) Solder Joint Intermittency Detection SJ BIST
Related Products
- Sentinel Interconnect™, Diagnostics and Prognostics Tools for Electrical Interconnects
- TSV BIST™, Die-Level Integrity Monitors
- Sentinel Suite™, Family of Advanced Diagnostics and Prognostics Tools
- Sentinel Motion™, a product line that includes wireless vibration and motion signature monitoring sensors, prognostic reasoners, and a visualization tool
- Sentinel Power™, a product line for monitoring power systems, providing diagnostics and prognostics analysis and visualization
- Sentinel Interconnect™, a product line that includes embedded monitors for detecting intermittencies and degradation in crucial system interconnects, and a visualization tool
- Sentinel IT™, a product line that provides solutions for improving IT network reliability and network health management (NHM).
Webinars
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Interconnect Intermittency Detection with SJ BIST™ – Broadcast by Microsemi
Click here to download the webinar presentation (PPTX)
Ridgetop is certified as category 1A under the Defense Microelectronics Activity (DMEA) as part of the Trusted Supplier Program. Ridgetop has history of designing analog and mixed signal ICs for demanding applications in space satellites that are subjected to extreme temperatures and radiation. Our designs have utilized bulk CMOS, CMOS-SOI, and SiGe at process geometries down to 28 nm channel lengths. Radiation hardness is also a concern, and Ridgetop has addressed those requirements as well. A recent Ridgetop design was delivered to ON Semiconductor for the U.S. Air Force STELLAR Star Tracker.
Under contract to NASA, Ridgetop designed an effective 3-axis wireless rotational sensor. The RotoSense™ sensor has been tested on fast-spinning pinion gears on helicopter gear boxes, and also rolling stock for railroad safety improvements.