The semiconductor intellectual property (IP) cores provided by Ridgetop are “Silicon Proven” and
have documented reports available. Ridgetop has designed cores for
use in various IBM, TSMC, ON Semiconductor, and X-Fab processes. Ridgetop specializes in analog and mixed-signal designs for harsh environments, especially where radiation-hardening is required.
- Analog-to-Digital Converter (ADC) Cores
- Digital-to-Analog Converter (DAC) Cores
- DC-to-DC Switching Converters
- Bandgap Reference (BGR) Cores
- Op-amps and Comparators Cores
- Controlled Delay Line Cores
- Power Switch Cores
- Charge Pump Cores
Ridgetop has been certified by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense as a Category 1A Trusted Supplier of Design Services as part of the Trusted Foundry Program.
For more information, please click here or follow the links below.
Overviews
- ADC Technology Overview
- Radiation-Hardened (Rad-Hard) Electronics Capabilities
- FYRE Semiconductor Catalog
Product briefs
- 14-bit ADC/VGA, 40 MS/s, TSMC 180 nm IP Core
- Rad-Hard Programmable SiGe ADC, 3 GS/s at 12-bit, 500 MS/s at 14-bit Resolution
- 12-bit, 650 MS/s, Rad-Hard SiGe ADC, IBM 130 nm IP Core
- Rad-Hard Adjustable Sample Rate ADC, 12-bit, Ultra-Low Power
- Ultra-High Efficiency DC-DC Switching Converter Circuit
- 16-bit DAC, 100 KS/s TSMC 250 nm IP Core
- ADC 10-bit, 4 MS/s, TSMC 0.25 µm IP Core
Press Releases
Related products
- Analog-to-Digital Converter (ADC) Cores
- Digital-to-Analog Converter (DAC) Cores
- DC-to-DC switching converters
- nanoDFM™ Foundry-Independent Tools for Yield Improvement
- PDKChek™ Foundry-Independent Die-Level Monitors
- YieldMaxx™ Die-Level Process Monitor Visualization
- Sentinel Silicon™ Die-Level Reliability Monitors
- ProChek™ Semiconductor Process Reliability Characterization System
Ridgetop is certified as category 1A under the Defense Microelectronics Activity (DMEA) as part of the Trusted Supplier Program. Ridgetop has history of designing analog and mixed signal ICs for demanding applications in space satellites that are subjected to extreme temperatures and radiation. Our designs have utilized bulk CMOS, CMOS-SOI, and SiGe at process geometries down to 28 nm channel lengths. Radiation hardness is also a concern, and Ridgetop has addressed those requirements as well. A recent Ridgetop design was delivered to ON Semiconductor for the U.S. Air Force STELLAR Star Tracker.
Under contract to NASA, Ridgetop designed an effective 3-axis wireless rotational sensor. The RotoSense™ sensor has been tested on fast-spinning pinion gears on helicopter gear boxes, and also rolling stock for railroad safety improvements.