The success of nano-level integrated circuits depends on the integration of advanced methodologies throughout the entire semiconductor process development cycle. Ridgetop Group’s nanoDFM product suite provides that level of integration, to combat yield losses stemming from process-related and design-related problems. nanoDFM improves the reliability of emerging nanolevel processes for fabless and fab manufacturers.
The interaction between design and manufacturing, particularly as it relates to yield and reliability, extends beyond on-site measurements and design simulations alone. Ridgetop’s nanoDFM technologies apply advanced and patented in-situ test structures and iterative improvements. By providing performance metrics and electrical testing, useful lifetime is increased and yields improved. To do this, the most sensitive circuits must be identified as well as the mechanisms likely to have negative effects.
nanoDFM die-level process monitor design flow
The PDKChek™ library of DLPM blocks and the YieldMaxx™ software visualization tool are members of the nanoDFM product family.
YieldMaxx Visualization Software
Features and Benefits
- Mismatch measurement of threshold voltage (VT)
- Nano-level (sub-90 nm) measurement of feature size transistors
- Mismatch measurement of resistance and capacitance
- Die-to-die variation analysis
- Long-term reliability and variation analysis
- Extensibility
- Digital output (option)
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Overview
Product Briefs
- PDKChek Independent Die-Level Monitor™
- YieldMaxx Design for Manufacturing Die-Level Process Monitor (DLPM) Data Analysis Too™
Ridgetop is certified as category 1A under the Defense Microelectronics Activity (DMEA) as part of the Trusted Supplier Program. Ridgetop has history of designing analog and mixed signal ICs for demanding applications in space satellites that are subjected to extreme temperatures and radiation. Our designs have utilized bulk CMOS, CMOS-SOI, and SiGe at process geometries down to 28 nm channel lengths. Radiation hardness is also a concern, and Ridgetop has addressed those requirements as well. A recent Ridgetop design was delivered to ON Semiconductor for the U.S. Air Force STELLAR Star Tracker.
Under contract to NASA, Ridgetop designed an effective 3-axis wireless rotational sensor. The RotoSense™ sensor has been tested on fast-spinning pinion gears on helicopter gear boxes, and also rolling stock for railroad safety improvements.