What is YieldMaxx?
- Advanced design-for-manufacturing (DFM) tool for fabless semiconductor firms.
- Patented, die-level structures provide precision, on-die measurements of key performance parameters, including threshold voltage (VT), resistance, capacitance and on-current variations.
- Complements PDKChek™ test structure and software solution for displaying device mismatch.
- Independent solution provides framework for foundry-to-foundry comparisons.
- Prevents costly probe damage from conventional measurement methods.
- Part of the nanoDFM™ product line.
Graphical Utility (YieldMaxx)
The YieldMaxx software provides visual indications of device mismatch parameters, as shown below:
YieldMaxx screen- click to enlarge
Test Structure Portion (PDKChek)
- Die-level, in-situ test structure that occupies minimal silicon area.
- Patent-protected, stand-alone, proprietary IP block that measures die-level process-induced variations.
- Measures MOS transistor threshold voltage (VT), resistance, capacitance, and turn on/off current.
- Die-level testing takes advantage of test structures and bonding pads that are already present on the die, so there is no additional error introduced by the contact resistance of a probe station.
- Layout on the die along with the host circuit.
- Designed to extract electrical measurements from several test devices (transistors, resistors, capacitors).
GDS II layout of PDKChek
For more information, please click here or visit the links below.
Overview
Product Briefs
- PDKChek Independent Die-Level Monitor™
- YieldMaxx Design for Manufacturing Die-Level Process Monitor (DLPM) Data Analysis Too™
Ridgetop is certified as category 1A under the Defense Microelectronics Activity (DMEA) as part of the Trusted Supplier Program. Ridgetop has history of designing analog and mixed signal ICs for demanding applications in space satellites that are subjected to extreme temperatures and radiation. Our designs have utilized bulk CMOS, CMOS-SOI, and SiGe at process geometries down to 28 nm channel lengths. Radiation hardness is also a concern, and Ridgetop has addressed those requirements as well. A recent Ridgetop design was delivered to ON Semiconductor for the U.S. Air Force STELLAR Star Tracker.
Under contract to NASA, Ridgetop designed an effective 3-axis wireless rotational sensor. The RotoSense™ sensor has been tested on fast-spinning pinion gears on helicopter gear boxes, and also rolling stock for railroad safety improvements.