Ridgetop has developed a broad line of products and technologies over the years. Here you will find Ridgetop’s current corporate, technology, and product overviews, as well as the collected product briefs and datasheets.

• Corporate
• Applications
• Technologies
• Advanced Diagnostics and Prognostics Products and Datasheets
• Precision Instrumentation Products and Datasheets
• Semiconductor Products and Datasheets

Corporate

• Ridgetop Group Corporate Overview

Applications

• Prognostics Overview
• Radiation Hardening Capabilities Overview
• Aircraft Maintenance, Repair, and Overhaul (MRO) Engineering Solutions
• ADC Technology Overview

Technologies

• RingDown™ Power Prognostics
• nanoDFM™ Technologies
• IC Die-Level Monitoring Solutions
• MEMS Technology at Ridgetop

Advanced Diagnostics and Prognostics Products and Datasheets

• Sentinel Suite brochure
• SJ BIST™ for Mission-Critical Electronics Overview
• ARULE™ Reasoner – Adaptive Remaining Useful Life Reasoner for PHM Applications
• Sentinel Network™ Prognostics & Health Management Analysis Platform
• SMRT Probe™ Resonant Voltage-Sampling Sensor
• SJ BIST™ – Solder Joint Built-in Self-Test
• SJ BIST™ for Custom Applications
• Datasheet – Solder Joint Built-In Self-Test™ A (SJ BIST™ A)
• RotoSense™ Rotational Vibration Sensor

Precision Instrumentation Products

• ProChek™ Semiconductor Process Characterization System
• ProChek™ Wafer-Level Semiconductor Process Characterization System
• Expert Troubleshooting & Repair System™ (ETRS™)
• CPT1000™ Cable Power Test System

Semiconductor Product Briefs and Datasheets

• Semiconductor FYRE Catalog
• RadCell Vt™ Prognostic Cell
• PDKChek™ Independent Die-Level Monitor
• Datasheet – PDKChek Independent Die-Level Monitor
• Hot Carrier (HC) Measurements
• Ultra-High Efficiency DC-DC Switching Converter Circuit
• InstaBIST™ ADC BIST IP Core
• Rad-Hard Programmable SiGe ADC, 3 GS/s at 12-bit, 500 MS/s at 14-bit Resolution
• 12-bit, 650 MS/s, Rad-Hard SiGe ADC, IBM 130 nm IP Core
• Rad-Hard Adjustable Sample Rate ADC, 12-bit, Ultra-Low Power
• Rad-Hard SiGe ADC, 12-bit, 2 GS/s, IBM 130 nm
• 16-bit DAC, 100 KS/s TSMC 250 nm IP Core
• ADC 10-bit, 4 MS/s, TSMC 0.25 µm IP Core
• Datasheet – ADC 10-bit, 4 MSPS TSMC 0.25 µm IP Core
• NBTI Prognostic Cell
• 14-bit ADC/VGA, 40 MS/s, TSMC 180 nm IP Core
• YieldMaxx™ Design for Manufacturing Die-Level Process Monitor (DLPM) Data Analysis Tool
• Time-Dependent Dielectric Breakdown (TDDB) Prognostic BIST Cell
• RadCell Fox™ Prognostic Cell
• SJ BIST™ for Custom Applications