Ridgetop has developed a broad line of products and technologies over the years. Here you will find Ridgetop’s current corporate, technology, and product overviews, as well as the collected product briefs and datasheets.
- Corporate
- Applications
- Technologies
- Advanced Diagnostics and Prognostics Products and Datasheets
- Precision Instrumentation Products and Datasheets
- Semiconductor Products and Datasheets
Corporate
Applications
- Prognostics Overview
- Radiation Hardening Capabilities Overview
- Aircraft Maintenance, Repair, and Overhaul (MRO) Engineering Solutions
- ADC Technology Overview
Technologies
- RingDown™ Power Prognostics
- nanoDFM™ Technologies
- IC Die-Level Monitoring Solutions
- MEMS Technology at Ridgetop
Advanced Diagnostics and Prognostics Products and Datasheets
- Sentinel Suite brochure
- SJ BIST™ for Mission-Critical Electronics Overview
- ARULE™ Reasoner – Adaptive Remaining Useful Life Reasoner for PHM Applications
- Sentinel Network™ Prognostics & Health Management Analysis Platform
- SMRT Probe™ Resonant Voltage-Sampling Sensor
- SJ BIST™ – Solder Joint Built-in Self-Test
- SJ BIST™ for Custom Applications
- Datasheet – Solder Joint Built-In Self-Test™ A (SJ BIST™ A)
- RotoSense™ Rotational Vibration Sensor
Precision Instrumentation Products
- ProChek™ Semiconductor Process Characterization System
- ProChek™ Wafer-Level Semiconductor Process Characterization System
- Expert Troubleshooting & Repair System™ (ETRS™)
- CPT1000™ Cable Power Test System
Semiconductor Product Briefs and Datasheets
- Semiconductor FYRE Catalog
- RadCell Vt™ Prognostic Cell
- PDKChek™ Independent Die-Level Monitor
- Datasheet – PDKChek Independent Die-Level Monitor
- Hot Carrier (HC) Measurements
- Ultra-High Efficiency DC-DC Switching Converter Circuit
- InstaBIST™ ADC BIST IP Core
- Rad-Hard Programmable SiGe ADC, 3 GS/s at 12-bit, 500 MS/s at 14-bit Resolution
- 12-bit, 650 MS/s, Rad-Hard SiGe ADC, IBM 130 nm IP Core
- Rad-Hard Adjustable Sample Rate ADC, 12-bit, Ultra-Low Power
- Rad-Hard SiGe ADC, 12-bit, 2 GS/s, IBM 130 nm
- 16-bit DAC, 100 KS/s TSMC 250 nm IP Core
- ADC 10-bit, 4 MS/s, TSMC 0.25 µm IP Core
- Datasheet – ADC 10-bit, 4 MSPS TSMC 0.25 µm IP Core
- NBTI Prognostic Cell
- 14-bit ADC/VGA, 40 MS/s, TSMC 180 nm IP Core
- YieldMaxx™ Design for Manufacturing Die-Level Process Monitor (DLPM) Data Analysis Tool
- Time-Dependent Dielectric Breakdown (TDDB) Prognostic BIST Cell
- RadCell Fox™ Prognostic Cell
- SJ BIST™ for Custom Applications